Description

The 7AF-HMG is a grinding system engineered for silicon carbide wafer thinning, featuring real-time grind performance monitoring, a self-dressing grind process, and wafer-flipping capability for double-sided processing across dual coarse-grind, dual fine-grind and standard modes. This company reports it can extend grinding wheel life roughly 9x and increase wafer output by about 15% versus conventional grinders, lowering the total cost of ownership for SiC wafer manufacturing. Product Type: Precision Machining & Manufacturing

Specifications

Category

Machine Tools

Location

825 Buckley Rd, San Luis Obispo, CA 93401, USA

Listed

3 weeks ago

Views

17