Description
Advanced wafer grinding platform for thin-wafer and advanced semiconductor applications. (Product page: *** Product Type: Wafer Grinding System
Specifications
- Category
- Other Industrial Products
- Location
- 825 Buckley Rd, San Luis Obispo, CA 93401, USA
- Listed
- 3 weeks ago
- Views
- 9
7AF-I
Ask price
825 Buckley Rd, San Luis Obispo, CA 93401, USA
R
rev772133
Identity revealed after deal is confirmed
