Description

Wafer back-end services, Chip bonding, Flip-chip packaging, Opto-packaging, Fan-out wafer-level packaging, Surface mount technology Product Type: Packaging & Hermetic Sealing

Specifications

Category: Packaging & Handling
Location: James-Franck-Str 10 Berlin Germany 12489
Listed: 3 weeks ago
Views: 19

Chip bonding

Ask price

James-Franck-Str 10 Berlin Germany 12489

A

aem368178

Identity revealed after deal is confirmed

Contact Seller

Your message goes straight to this seller about Chip bonding. Just click Send Inquiry — the seller will respond soon.

Already registered? Log in

Related Products

Test Sockets

Ask price

Copperhead Thermal Test Socket

Ask price

Hermetic TO Packages

Ask price

MRSI-LEAP High-Speed Die Bonders

Ask price

MRSI-705 die bonder

Ask price

CODE RED Hermetic Solutions

Ask price

Safe-Guard PET-G Optics Packaging Containers

Ask price

Hermetic Optical Cells

Ask price