Description
High-accuracy die-bonding platform for multi-chip and flip-chip applications. (Product page: *** Product Type: Multi-Chip Die Bonder
Specifications
- Category
- Other Industrial Products
- Location
- No. 1 Science Park 2 Capricorn Building, Science Park Rd, Singapore 117528
- Listed
- 3 weeks ago
- Views
- 11
Datacon 2200 evo
Ask price
No. 1 Science Park 2 Capricorn Building, Science Park Rd, Singapore 117528
B
bes664565
Identity revealed after deal is confirmed
