Description

High-speed 2D/3D pattern inspection and metrology platform (current generation Dragonfly G5) used for sub-micron defect detection down to about 150nm, combining high-speed line-scan imaging with AI-based defect classification for in-line advanced packaging process control, including wafer-to-wafer and die-to-wafer bonding inspection.

Specifications

Category

Other Industrial Products

Location

Milpitas, California, United States

Listed

3 weeks ago

Views

10