Description

The DSP-100 is Nikon's digital lithography system for advanced semiconductor packaging, using a spatial light modulator to project circuit patterns directly onto substrates without a photomask. It supports large panels up to 600mm square with 1.0 micrometer line/space resolution, overlay accuracy within plus/minus 0.3 micrometers, and throughput of up to 50 panels per hour, giving roughly nine times the per-substrate productivity of 300mm wafer processing for panel-level packaging.

Specifications

Category

Other Industrial Products

Location

Belmont, California, and Nikon Precision Europe GmbH, headquartered in Langen, Germany

Listed

3 weeks ago

Views

8