Description

The FPIM Series is Taiyo Holdings' next-generation semiconductor packaging material, a negative-tone, i-line photosensitive insulating material developed for fine-pitch redistribution layer (RDL) formation using a dual-damascene process. Developed with imec, it has demonstrated three-layer RDL formation with critical dimensions down to 700 nm on 12-inch wafers, targeting advanced packaging applications that require finer wiring than conventional RDL materials support.

Specifications

Category

Other Industrial Products

Location

133 New Bridge Road, #09-08 Chinatown Point, Singapore 059413

Listed

3 weeks ago

Views

19