Description

The M17D is a fully automatic ultrasonic wire bonder built on the M17 platform but equipped with two bonding heads, allowing higher throughput or dual-process capability (e.g., mixing wire types or bond styles) in a single machine. Like other M17-series bonders, it handles ball-wedge, fine-wire, and heavy-wire/ribbon bonding for power electronics, MEMS, sensors, and hybrid circuit assembly.

Specifications

Category

Other Industrial Products

Location

27182 Burbank, Foothill Ranch, CA 92610, USA

Listed

3 weeks ago

Views

8