Description

The M17S is F&K Delvotec's compact single-head, fully automatic ultrasonic wire bonder with a work area of roughly 254 x 152 x 40 mm. It supports ball-wedge, fine-wire, and heavy-wire/ribbon bonding in gold, aluminum, and copper, with patented Bond Process Control for in-process monitoring. It is used for MEMS, sensors, optoelectronics, RF/HF, hybrid circuits, power devices, and battery management modules, and can be configured from manual to fully inline automation.

Specifications

Category

Other Industrial Products

Location

27182 Burbank, Foothill Ranch, CA 92610, USA

Listed

3 weeks ago

Views

8