Description
Laser micromachining system for separating silicon and silicon-carbide wafers using thermal laser separation. (Product page: *** Product Type: Wafer Dicing System
Specifications
- Category
- Other Industrial Products
- Location
- Technologie-Campus 8, 09126 Chemnitz, Germany
- Listed
- 3 weeks ago
- Views
- 11
microDICE
Ask price
Technologie-Campus 8, 09126 Chemnitz, Germany
D
dmi723122
Identity revealed after deal is confirmed
