Description
High-throughput die bonding platform for semiconductor and advanced packaging applications. (Product page: *** Product Type: High-Speed Die Bonder
Specifications
- Category
- Other Industrial Products
- Location
- 101 Billerica Ave #3, North Billerica, MA 01862
- Listed
- 3 weeks ago
- Views
- 10
MRSI-HVM
Ask price
101 Billerica Ave #3,
North Billerica, MA 01862
M
mrs328706
Identity revealed after deal is confirmed
