Description
Wafer back-end services, Chip bonding, Flip-chip packaging, Opto-packaging, Fan-out wafer-level packaging, Surface mount technology Product Type: Optomechanics & Assemblies
Specifications
- Category
- Parts & Accessories
- Location
- James-Franck-Str 10 Berlin Germany 12489
- Listed
- 3 weeks ago
- Views
- 14
Surface mount technology
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James-Franck-Str 10 Berlin Germany 12489
A
aem368178
Identity revealed after deal is confirmed