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Description

Wafer back-end services, Chip bonding, Flip-chip packaging, Opto-packaging, Fan-out wafer-level packaging, Surface mount technology Product Type: Optomechanics & Assemblies

Specifications

Category
Parts & Accessories
Location
James-Franck-Str 10 Berlin Germany 12489
Listed
3 weeks ago
Views
14

Surface mount technology

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James-Franck-Str 10 Berlin Germany 12489
A

aem368178

Identity revealed after deal is confirmed

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