Description
Precision blades used for semiconductor wafer and substrate singulation. (Product page: *** Product Type: Dicing Consumable
Specifications
- Category
- Other Industrial Products
- Location
- 5 HaMada St., P.O. Box 87. Hi-Tech Park (South) Yokneam 2069202, Israel
- Listed
- 3 weeks ago
- Views
- 11
Wafer Dicing Blades
Ask price
5 HaMada St., P.O. Box 87. Hi-Tech Park (South) Yokneam 2069202, Israel
A
adv977518
Identity revealed after deal is confirmed
