Description
Thermo-compression bonding system for chiplet and interposer packages. (Product page: *** Product Type: Thermo Compression Bonder
Specifications
- Category
- Other Industrial Products
- Location
- No. 1 Science Park 2 Capricorn Building, Science Park Rd, Singapore 117528
- Listed
- 3 weeks ago
- Views
- 12
9800 TC next
Ask price
No. 1 Science Park 2 Capricorn Building, Science Park Rd, Singapore 117528
B
bes664565
Identity revealed after deal is confirmed
