Description

BONDSCALE is EV Group's automated production fusion bonding system for 200mm and 300mm wafers, built for engineered-substrate manufacturing and layer-transfer-based 3D integration processes. It incorporates enhanced edge-alignment technology to deliver high-throughput, void-free, high-yield wafer bonding with lower cost of ownership than earlier fusion bonding platforms.

Specifications

Category

Other Industrial Products

Location

7700 South River Parkway Tempe, AZ 85284

Listed

3 weeks ago

Views

13