Description
Multi-chip die bonder for high bonding-force applications. (Product page: *** Product Type: High-Force Die Bonder
Specifications
- Category
- Other Industrial Products
- Location
- No. 1 Science Park 2 Capricorn Building, Science Park Rd, Singapore 117528
- Listed
- 3 weeks ago
- Views
- 13
Datacon 2200 evo hF
Ask price
No. 1 Science Park 2 Capricorn Building, Science Park Rd, Singapore 117528
B
bes664565
Identity revealed after deal is confirmed
