Description
Precision grinding equipment for semiconductor wafer thinning. (Product page: *** Product Type: Grinding Machine
Specifications
- Category
- Other Industrial Products
- Location
- Tempe, AZ, United States
- Listed
- 3 weeks ago
- Views
- 13
DFG Series
Ask price
Tempe, AZ, United States
D
dis512756
Identity revealed after deal is confirmed
