Description

Key Features Stress & Bow Measurement: Reliable performance at high temperatures. Thermal Cycle Capability: Programmable for inert gas (up to 900°C) or vacuum (up to 1100°C). Wide Bow Range: Measures bow from sub-micron to millimeter scales. Integrated Metrology: Simultaneously analyzes stress hysteresis, TDS, shrinkage, resistivity, and reflectivity. Advanced Optics: Dual laser system adapts to reflective and translucent films. Whole Wafer Monitoring: Trend analysis with up to 100 channels. Software & Export: Windows compatibility, JPEG exports, and CTE calculation. Technical Specifications Temperature Range: Room temperature to 900°C (optional 1100°C). Ramp Rate: 1–50°C/min, programmable with ramp and hold cycles. Wafer Size: 50mm to 300mm (round or square). Vacuum: Turbo molecular dry pump, up to 5×10⁻⁶ Torr. Inert Gas Options: Nitrogen, Argon, Forming Gas. Chamber Design: RTP-type with tungsten halogen lamps, gold-plated reflective walls, and water cooling. Sample Loading: Quartz susceptor for smooth operation. Footprint: Main Unit: 26” (W) X 58.24” (D) Accessory Cart (Resistivity): 20” (W) X 20” (D) Weight: 400 lbs. Power: 208V, 30A, 3-phase, 5 wires (neutral and ground). Optional Capabilities Film Thickness Measurement: Accurate for films ≥3000Å at up

Specifications

Manufacturer

FSM

Condition

USED

Location

Mipitas, CA, USA

Listed

1 month ago

Views

20