Description

TCP9600SE Etch System with DSQ & APM Model: TCP9600SE with DSQ & APM Condition: Fully Refurbished to OEM Specifications Wafer Size: 200 mm (8 inch) Stock Number: BM4135 Equipment Details Equipment Type: Semiconductor Etch System Category: Surface Treatment / Cleaning Subcategory: Etch / Ash – Semiconductor Fabrication System Configuration Operator Interface: Bulkhead Software: Envision Wafer Transportation Size: 200 mm (8 inch) Indexer: Hine 38A Load Station: Belt-Type Shuttle with Standard Edge Detector and Load Lifter Chamber Configuration Middle Chamber: 6 cm Fixed Gap (***) Top Ceramic Plate: *** Wafer Clamping: ESC (Notch) RF Generator Configuration TCP RF Generator: RFG1250 Bias RF Generator: RFG1250 DSQ RF Generator: RFG1250 Chamber Manometers Main Manometer 3 Torr Manometer Reference Manometer Matching Network TCP Matcher: *** Bias Matcher: *** DSQ Matcher: Included Vacuum System Turbo Pump: Alcatel ATH-1300M Pressure Control Main: VAT Valve 64PM & PM5 DSQ: MDVX-018 & AC-2 Additional Configuration Hinged DSQ Heated Paddle WVDS: Manual Fill Chamber Heater Controller: 12-Loop External Anafaze Gas Box: Orbitally Welded, Total 8 Gases Closed-Loop Helium Cooling: UPC8130 & Tylan CDL-12S13 (20 Torr) Remote Power Module: Main 175 A Remote Power Module Description The TCP9600SE with DSQ & APM is a 200 mm semiconductor etch system configured for advanced wafer processing applications. The system has been fully refurbished to OEM specifications and includes Envision software, Hine 38A indexer, belt-type wafer loading, electrostatic chuck, multiple RFG1250 RF generators, and an Alcatel ATH-1300M turbo pump. The tool is equipped with an 8-gas orbitally welded gas box, closed-loop helium backside cooling, multiple chamber manometers, pressure-control hardware, heated paddle, and a 12-loop external chamber heater controller. This system is suitable for semiconductor fabrication, plasma etching, process development, R&D, and 200 mm wafer manufacturing applications.