Description

The M17L is a fully automatic ultrasonic wire bonder from F&K Delvotec's M17 platform offering the largest work area in the series for fine-wire bonding applications. It supports gold, aluminum, and copper wire processes and is aimed at applications needing larger substrates or panels, such as hybrid circuits, sensors, and power modules.

Specifications

Category

Other Industrial Products

Location

27182 Burbank, Foothill Ranch, CA 92610, USA

Listed

3 weeks ago

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10