Description

A second FIB-SEM combination system in This company's wafer fab solutions lineup, likewise engineered for rapid, nanometer-precise sampling and three-dimensional analysis of semiconductor structures. It is used for detailed cross-sectional imaging and volumetric defect analysis to support process development and failure analysis in chip manufacturing.

Specifications

Category

Other Industrial Products

Location

Carl-Zeiss-Straße 22 73447 Oberkochen Germany

Listed

3 weeks ago

Views

14