Description

Year: 2004 Condition: Used Wafer Size: 200 mm Location: Ireland Equipment Details Equipment Type: High-Speed Wafer Inspection System Application: Bare Wafer Inspection Category: Semiconductor Metrology / Inspection Subcategory: Metrology Key Features 200 mm Wafer Capability High-Speed Wafer Inspection Bare Wafer Surface Inspection Automated Defect Detection Particle and Surface Defect Inspection Semiconductor Process Monitoring Description This 2004 high-speed wafer inspection system is designed for automated inspection of 200 mm bare semiconductor wafers. The system is intended for detecting particles, surface defects, and other wafer abnormalities during semiconductor manufacturing and quality-control processes. It is suitable for bare wafer inspection, incoming wafer quality control, process monitoring, semiconductor manufacturing, and research applications. Detailed model information, detection sensitivity, throughput, laser configuration, wafer handling configuration, software version, and current operational condition should be confirmed with the seller. For this 200 mm inspection system