Description

Specifications Film Stress Range: 1 MPa to 1.4 GPa (for Si wafers with ≥1µm bow/curvature change) Bow Sensitivity: Detects 1-micron height changes (P-doped Si) Scan Range: 3mm edge exclusion Mapping: 32 scan lines (6 recommended) with 40 data points/mm Bow Measurement: Measures bow heights up to 2000µm Advanced Optics: Patented dual laser switching for accuracy Software: Windows 7–11 compatibility, data export to Excel™, JPEG maps Operating Conditions: Ambient temperature Measurement Method: Non-contact laser scanning Wafer Compatibility: FSM 128NT: 50mm to 200mm FSM 128L: 50mm to 300mm Wafer thickness: <5mm Scanning: High-precision single scan and programmable multiple diametric scans for 2D/3D mapping Repeatability: 1% (1 sigma) on a 20m curvature mirror standard Accuracy: <2.5% on a 20m radius curvature mirror Laser Class: Class 1 FSM 128 Data and Connectivity Export results to Excel™ or JPEG.

Specifications

Manufacturer

FSM

Category

Metrology & Inspection

Condition

NEW

Location

USA

Listed

1 month ago

Views

35