Description

200mm X-Ray Fluorescence (XRF) Inspection System Year: 2005 Condition: Used Wafer Size: 200 mm Location: South Korea Equipment Details Equipment Type: X-Ray Fluorescence (XRF) Inspection System Application: Wafer / Thin-Film Material Analysis Category: Semiconductor Metrology / Inspection Subcategory: Front-End Equipment / Metrology Equipment Key Features X-Ray Fluorescence (XRF) Measurement 200 mm Wafer Capability Non-Destructive Material Analysis Elemental Composition Analysis Semiconductor Process Monitoring Thin-Film Metrology Description This 2005 X-Ray Fluorescence (XRF) inspection system is designed for non-destructive analysis and metrology of semiconductor wafers and materials. XRF technology can be used to determine elemental composition and, depending on the system configuration and calibration, measure or monitor the thickness and composition of selected thin-film layers. The system supports 200 mm wafers and is suitable for semiconductor process monitoring, materials characterization, thin-film analysis, and quality-control applications.