Description

Rudolph MetaPULSE II 200X Thickness Measurement System Manufacturer: Rudolph Model: MetaPULSE II 200X Condition: Used Wafer Size: 200 mm Location: Grapevine, Texas, USA Specifications Wafer Size: 200 mm Equipment Type: Thin Film Thickness Measurement System Category: Semiconductor Metrology / Inspection Subcategory: Metrology & Inspection Measurement Type: Non-Destructive Opaque Thin-Film Metrology Supported Processes Aluminum Interconnect Processes Silicide Processes Ultra-Thin Barrier Films Tungsten Processes Barrier Layers Seed Layers Electroplated Copper Advanced Dual-Damascene Processes Description The Rudolph MetaPULSE II 200X is a semiconductor thin-film thickness measurement system designed for non-destructive metrology of opaque films used in advanced semiconductor manufacturing. The system supports 200 mm wafers and is suitable for monitoring aluminum interconnect, silicide, ultra-thin barrier, tungsten, barrier, seed, and electroplated copper processes. The MetaPULSE platform provides a practical metrology solution for semiconductor process development, production monitoring, quality control, and advanced interconnect applications. Its broad process capability makes it suitable for both conventional aluminum interconnect manufacturing and advanced copper dual-damascene semiconductor processes.

Specifications

Category

Metrology & Inspection

Condition

USED

Location

USA

Listed

1 month ago

Views

13