Description

Wafer back-end services, Chip bonding, Flip-chip packaging, Opto-packaging, Fan-out wafer-level packaging, Surface mount technology Product Type: Semiconductor & Wafer Materials

Specifications

Category: Semiconductor & Electronics
Location: James-Franck-Str 10 Berlin Germany 12489
Listed: 3 weeks ago
Views: 15

Fan-out wafer-level packaging

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James-Franck-Str 10 Berlin Germany 12489

A

aem368178

Identity revealed after deal is confirmed

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